Circuits and Systems for Communications

Gerald Sobelman (TC Chair)	University of Minnesota sobelman@ece.umn.edu
Nam Ling (past Chair)	Santa Clara University nling@scu.edu
Lap-Pui Chau (TC Chair-Elect)	Nanyang Technological University elpchau@ntu.edu.sg
Chang-Ho Lee (TC Secretary)	Samsung Electro-Mechanics @
Mohamed Elgamel (TC Webmaster)	University of Louisiana at Lafayette ms@cacs.louisiana.edu
Yucel Altunbasak	Georgia Institute of Technology yucel@ece.gatech.edu
Paul Ampadu	University of Rochester ampadu@ece.rochester.edu
Wael Badawy	University of Calgary badawy@ucalgary.ca
Stephen Bates	University of Alberta sbates@ece.ualberta.ca
Magdy Bayoumi	University of Louisiana at Lafayette mab@cacs.louisiana.edu
Tzi-Dar Chiueh	National Taiwan University chiueh@cc.ee.ntu.edu.tw
Jin-Gyun Chung	Chonbuk University, South Korea jgchung@chonbuk.ac.kr
Ezz I. El-Masry	Dalhousie University, Canada ezz.el-masry@dal.ca
Andrea Gerosa	University of Padova, Italy gerosa@dei.unipd.it
Xinming Huang	Worchester Polytechnic Institute xhuang@ece.wpi.edu
Raj Katti rajendra	North Dakota State University katti@ndsu.nodak.edu
Alexander Korotkov	St. Petersburg State Technical University korotkov@rphf.spbstu.ru
Shoba Krishnan	Shoba Krishnan, Santa Clara University
Ashok Kumar	University of Louisiana at Lafayette ak@cacs.louisiana.edu
Navid Lashkarian	National Semiconductors navid@Centillium.com
Chang-Ho Lee	Samsung Electro-Mechanics chang.lee@ece.gatech.edu
Hanho Lee	Inha University, South Korea hhlee@inha.ac.kr
Zhengguo Li	Institute for Infocomm Research, Singapore ezgli@i2r.a-star.edu.sg
David Lin	National Chiao Tung University, Hsinchu dwlin@mail.nctu.edu.tw
Weisi Lin	Nanyang Technological University, Singapore wslin@ntu.edu.sg
Derong Liu	University of Illinois at Chicago dliu@ece.uic.edu
Pui-In Mak	University of Macau, China pimak@umac.mo
Yehia Massoud	Rice University massoud@rice.edu
Maire McLoone	UK Royal Academy of Engineering, UK m.mcloone@ecit.qub.ac.uk
P. R. Mukund	Rochester Institute of Technology prmeee@rit.edu
Andrea Neviani	University of Padova, Italy neviani@dei.unipd.it
Tony Ng	The University of Hong Kong tsng@eee.hku.hk
Tokunbo Ogunfunmi	S.C.U. tokunbo@ieee.org
Vassilis Paliouras	University of Patras paliuras@ee.upatras.gr
Matt Robshaw	France Telecom Research & Development, France matt.robshaw@orangeftgroup.com
Wee Ser	Nanyang Technological University, Singapore ewser@ntu.edu.sg
Ramalingam Sridhar	State University of New York at Buffalo rsridhar@cse.buffalo.edu
Yichuang Sun	University of Hertfordshire, UK Y.Sun@herts.ac.uk
Myung Hoon Sunwoo	Ajou University sunwoo@ajou.ac.kr
C. Tepedelenlioglu	Arizona State University cihan@asu.edu
M. Torlak	The University of Texas at Dallas torlak@utdallas.edu
S. Ulukus	University of Maryland at College Park ulukus@eng.umd.edu
Khurram Waheed	Texas Instruments khurram@ti.com
Zhongfeng Wang	Broadcom zfwang@broadcom.com
Michael Weeks	Georgia State University mweeks@cs.gsu.edu
An-Yeu (Andy) Wu	National Taiwan University andywu@cc.ee.ntu.edu.tw
Zhiyuan Yan	Lehigh Univeristy yan@lehigh.edu
Xiaoquan (Bill) Yi	Google, USA byi@google.com
Chen-Xiong (Philipp) Zhang	Hisilicon/Huawei Technologies, USA/China
J. Zhang	Arizona State University Junshan.Zhang@asu.edu
Tong Zhang	R.P.I. tzhang@ecse.rpi.edu
Xinmao Zhang	Case Western Reserve University, USA xxz36@case.edu
Danella Zhao	University of Louisiana at Lafayette, USA dzhao@cacs.louisiana.edu
Wei Xing Zheng	University of Western Sydney w.zheng@uws.edu.au